Wire bonding apparatus and method for clamping a wire
US7481351B2 · kind B2 · utility
0Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2004 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Aug 5, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.