Kook-Jin Oh
4Patents
1h-index
12Co-inventors
37Inventor score
Filing activity: Aug 30, 2004 → Sep 25, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7793408B2 | Apparatus for transferring semiconductor chip | Emerging Cross-Sectional Technologies | 5 | Active |
| US7631795B2 | System and method for automated wire bonding | Electricity | 1 | Active |
| US7481351B2 | Wire bonding apparatus and method for clamping a wire | Electricity | 0 | Expired |
| US8829691B2 | Light-emitting device package and method of manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.