Overlay metrology using X-rays
US7481579B2 · kind B2 · utility
19Cited by
35References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2006 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Mar 2, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for inspection includes directing a beam of X-rays to impinge upon an area of a sample containing first and second features formed respectively in first and second thin film layers, which are overlaid on a surface of the sample. A pattern of the X-rays diffracted from the first and second features is detected and analyzed in order to assess an alignment of the first and second features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.