LED assembly and use thereof
US7482632B2 · kind B2 · utility
20Cited by
9References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2006 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Nov 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) assembly includes a first substrate carrying a first plurality of LEDs mounted thereon and a second substrate spaced apart from the first substrate. The second substrate carries a second plurality of LEDs thereon. The first and second substrates are thermally connected for thermal distribution between the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.