Enboa Wu
14Patents
7h-index
18Co-inventors
59Inventor score
Filing activity: Aug 17, 2000 → Nov 29, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6459150B1 | Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer | Electricity | 79 | Expired |
| US6433427B1 | Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication | Electricity | 65 | Expired |
| US7511365B2 | Thermal enhanced low profile package structure | Electricity | 59 | Expired |
| US7203426B2 | Optical subassembly of optical transceiver | Physics | 41 | Expired |
| US7754530B2 | Thermal enhanced low profile package structure and method for fabricating the same | Electricity | 38 | Active |
| US7482632B2 | LED assembly and use thereof | Electricity | 20 | Active |
| US7943052B2 | Method for self-assembling microstructures | Electricity | 15 | Active |
| US8013347B2 | Remote control lighting assembly and use thereof | Mechanical Engineering; Lighting; Heating | 6 | Active |
| US8672512B2 | Omni reflective optics for wide angle emission LED light bulb | Mechanical Engineering; Lighting; Heating | 5 | Active |
| US7351609B2 | Method for wafer level package of sensor chip | Electricity | 4 | Active |
| US8558254B1 | High reliability high voltage vertical LED arrays | Electricity | 1 | Active |
| US7013066B1 | Tunable long period fiber grating structure and fabrication method | Physics | 1 | Expired |
| US7271020B2 | Light emitting diode covered with a reflective layer and method for fabricating the same | Electricity | 1 | Expired |
| US7474287B2 | Light emitting device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.