Burn-in testing apparatus and method
US7482825B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2007 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Oct 30, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2896
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.