Structural analysis program, a structural analysis method, a structural analysis apparatus, and a production process of a semiconductor integrated circuit
US7483818B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2002 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Mar 2, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/23
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A structural analysis program which enables easy structural analysis in accordance with a finite element method based on data representing a two-dimensional shape. A two-dimensional model of a structure is produced in response to a manipulation input which designates a material arrangement pattern and a thickness of each layer of the structure. A three-dimensional model is produced by adding the designated thickness of each layer to the material arrangement pattern of the layer so as to make the material arrangement pattern three-dimensional and stacking the three-dimensionalized material arrangement pattern of each layer. A finite element model is produced by dividing the three-dimensional model into a plurality of voxels. The computer performs structural analysis based on the produced finite element model. Thereby, an analysis result of a multilayer structure defined by the two-dimensional model is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.