Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems
US7485346B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2006 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Apr 1, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C5/0208
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and apparatus for controllably dispensing photoresist solutions and other fluids in semiconductor manufacturing equipment from an array of syringe-based fluid dispensers. A multi-syringe fluid dispensing system is provided for photoresist coating within a wafer track coating module. The coating module may contain a spin chuck that is positioned within a catch cup. A robotic dispense arm and gripper assembly may be positioned within the coating module for gripping and positioning a fluid syringe. An array of syringes may be stored on a solution tray within the wafer track coating module for holding a plurality of fluid syringes containing photoresist solutions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.