Printed circuit board including embedded chips and method of fabricating the same
US7485569B2 · kind B2 · utility
6Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2005 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Aug 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.