Device and method for improving interface adhesion in thin film structures
US7488661B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 7, 2006 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | May 1, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N50/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device and method for improving adhesion for thin film layers includes applying a diblock copolymer on a surface where adhesion to subsequent layers is needed and curing the diblock copolymer. Pores are formed in the diblock copolymer by treating the diblock copolymer with a solvent. The surface is etched through the pores of the diblock copolymer to form adhesion promoting features. The diblock copolymer is removed, and a layer is deposited on the surface wherein the adhesion promoting features are employed to promote adhesion between the layer and the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.