Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same
US7489032B2 · kind B2 · utility
209Cited by
4References
18Claims
0Family size
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Key dates
| Filing date | Dec 20, 2004 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Jan 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a base plate, and a semiconductor constituent body formed on the base plate. The semiconductor constituent body has a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. An insulating layer is formed on the base plate around the semiconductor constituent body. A hard sheet is formed on the insulating layer. An interconnection is connected to the external connecting electrodes of the semiconductor constituent body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.