Assembly including vertical and horizontal joined circuit panels
US7489524B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2005 |
| Grant date | Feb 10, 2009 |
| Priority date | — |
| Expiry date | Jan 4, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10484
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.