Patent · US Expired

Semiconductor substrate and process for producing it

US7491966B2 · kind B2 · utility

1Cited by

1References

8Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Dirk Dantz · Königslutter am Elm, DE
Andreas Huber · Holzgerlingen, DE
Reinhold Wahlich · Burghausen, DE
Brian Murphy · Pfarrkirchen, DE

Key dates

Filing date	Jun 21, 2005
Grant date	Feb 17, 2009
Priority date	—
Expiry date	Jan 29, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/324
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A process for producing a semiconductor substrate comprising a carrier wafer and a layer of single-crystalline semiconductor material:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.