Light emitting diode package
US7491978B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2006 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Jan 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
Abstract
A light emitting diode package is provided. The light emitting diode package comprises a submount substrate which includes a mounting region having side walls inclined upwardly, first and second cavities formed around the mounting region, and first and second grooves extending between the mounting region and the first and second cavities on an upper surface of the submount. The package further comprises first and second bump pads formed on a bottom surface of the mounting surface, first and second bonding pads formed on a bottom surface of the first and second cavities, respectively, first and second conductive lines formed along a bottom surface of the first and second grooves for connecting the first and second bump pads to the first and second bonding pads, respectively, and a light emitting diode mounted on the mounting region so as to be connected to the first and second bump pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.