Thin-film magnetic head structure, method of manufacturing the same, and thin-film magnetic head
US7492555B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 13, 2005 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Aug 17, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49032
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a thin-film magnetic head structure comprises the steps of preparing an insulating layer 10; forming a first resist layer 51 provided with a first slit pattern 51a corresponding to a very narrow groove part and a second slit pattern 51b corresponding to a temporary groove part integrally extending from the very narrow groove part along outer edges of a main depression onto the insulating layer 10; etching the insulating layer 10 while using the first resist layer 51 as a mask; eliminating the first resist layer 51; forming a second resist layer having an opening pattern corresponding to the main depression onto the insulating layer 10; and etching the insulating layer 10 while using the second resist layer as a mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.