Plasma processing apparatus and method, and electrode plate for plasma processing apparatus
US7494561B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2005 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | May 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32587
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus includes a process container configured to have a vacuum atmosphere therein. A first upper electrode is disposed to have a ring shape and to face a target substrate placed within the process container. A second upper electrode is disposed radially inside the first upper electrode and electrically insulated therefrom. A first electric feeder is configured to supply a first RF output from a first RF power supply to the first upper electrode at a first power value. A second electric feeder branches from the first electric feeder and is configured to supply the first RF output from the first RF power supply to the second upper electrode at a second power value smaller than the first power value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.