System and method for providing a power bus in a wirebond leadframe package
US7495320B2 · kind B2 · utility
1Cited by
1References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 27, 2006 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | Apr 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20759
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) package, such as a Quad Flat Pack (QFP), has at least one lead with a tip that extends substantially perpendicular to the ends of two or more bondwires, so that there is room for more than one bondwire to be attached to it along its length. Thus, bondwires leading from die bondpads that are not adjacent to one another can be efficiently connected to the same lead in a bus-like manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.