Substrate connector for integrated circuit devices
US7495330B2 · kind B2 · utility
10Cited by
26References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | Jul 17, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a stack is assembled comprising a first integrated circuit package, and a substrate connector which connects the integrated circuit package to a circuit board. In one embodiment, the substrate connector includes an interposer substrate and a patch substrate bonded to the interposer substrate. Each substrate includes columnar conductors extending through the substrate to connect to another layer. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.