Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
US7495331B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2006 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | Mar 24, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.