Silica nanoparticles thermoset resin compositions
US7498197B2 · kind B2 · utility
1Cited by
4References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2006 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | Sep 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A themosettable material having excellent processability, and which cures to form a thermoset composition having a low coefficient of thermal expansion and a high glass transition temperature includes functionalized nanoscopic silica particles dispersed in a curable resin comprising a polyepoxide having at least three epoxide groups per molecule. The composition is useful as an underfill for flip-chip circuit assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.