Method for locating flaws, and a marking system
US7499812B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2005 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | Feb 10, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30252
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In the method for locating flaws on the surface of a three-dimensional object the flaws are detected and located using one or more optical image-taking device. When a picture is taken showing a flaw the location of the flaw on the object is determined with great accuracy from the design data for the object, the optical imaging properties of the optical image-taking device, and the positions of the optical image-taking device and the object. A marking system for marking the position of the flaws on the object, which are detected by the method, is also described, which includes plural marking heads and displacement devices for positioning and/or activating the marking heads independently of each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.