Structure of image sensor module and method for manufacturing of wafer level package
US7501310B2 · kind B2 · utility
19Cited by
3References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2007 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Nov 27, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.