Patent · US Expired

Semiconductor device support element with fluid-tight boundary

US7501585B2 · kind B2 · utility

2Cited by

6References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Killer · Hohenschambach, DE
Hans-Ludwig Althaus · Lappersdorf, DE
Melanie Ring · Birkenfeld, DE

Key dates

Filing date	Jan 26, 2005
Grant date	Mar 10, 2009
Priority date	—
Expiry date	Mar 11, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/02375
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A support element and a semiconductor component including the support element, where the support element having at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary, which is arranged on the surface and at least partly surrounds the subregion of the surface. A method is also disclosed for arranging a semiconductor device on the surface of a support element, with the steps of: providing a support element which has at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary which is arranged on the surface and at least partly surrounds the subregion of the surface, introducing an adhesive fluid within the fluid-tight boundary, and introducing a semiconductor device into the adhesive fluid.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.