LDO regulator with ground connection through package bottom
US7501693B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2006 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | May 11, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low dropout (LDO) regulator device includes an LDO regulator integrated circuit housed in a 4-pin quad flat no-lead (QFN) package where the exposed die paddle is used as the ground terminal. The LDO regulator integrated circuit is formed on a semiconductor substrate. The 4-pin QFN package includes four perimeter lands connected to the input terminal, the output terminal, the enable terminal and the bypass terminal of the LDO regulator integrated circuit. The die paddle is to be electrically connected to a ground potential to allow the ground current of the LDO regulator integrated circuit to flow through the substrate and the die paddle of the 4-pin QFN package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.