Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same
US7501700B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2006 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Jan 6, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator has a first surface adjacent to a second surface of the first portion, and a second surface opposite to the first surface of the insulator and exposed to the outside. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.