Liquid cooled DUT card interface for wafer sort probing
US7501844B2 · kind B2 · utility
0Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2006 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Dec 14, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C29/56016
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A water block heat dissipation on a probe card interface for cooling active components and other devices requiring heat dissipation on the probe card is presented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.