John Andberg
20Patents
8h-index
21Co-inventors
71Inventor score
Filing activity: Sep 25, 1998 → Feb 19, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6340895B1 | Wafer-level burn-in and test cartridge | Physics | 131 | Expired |
| US6580283B1 | Wafer level burn-in and test methods | Physics | 92 | Expired |
| US6140616A | Wafer level burn-in and test thermal chuck and method | Electricity | 20 | Expired |
| US6413113B2 | Kinematic coupling | Physics | 18 | Expired |
| US10297339B2 | Integrated cooling system for electronics testing apparatus | Electricity | 18 | Active |
| US7088117B2 | Wafer burn-in and test employing detachable cartridge | Physics | 13 | Expired |
| US7193854B2 | Using a leaf spring to attach clamp plates with a heat sink to both sides of a component mounted on a printed circuit assembly | Electricity | 10 | Expired |
| US6787718B2 | Device, method, and system for detecting the presence of liquid in proximity to electronic components | Electricity | 8 | Expired |
| US6556032B2 | Wafer-burn-in and test employing detachable cartridge | Physics | 6 | Expired |
| US7147499B1 | Zero insertion force printed circuit assembly connector system and method | Physics | 5 | Expired |
| US7859277B2 | Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array | Physics | 4 | Expired |
| US7460371B2 | Wiffle tree components, cooling systems, and methods of attaching a printed circuit board to a heat sink | Electricity | 2 | Active |
| US9335347B2 | Method and apparatus for massively parallel multi-wafer test | Physics | 2 | Active |
| US7459921B2 | Method and apparatus for a paddle board probe card | Physics | 1 | Active |
| US7541822B2 | Wafer burn-in and text employing detachable cartridge | Physics | 1 | Expired |
| US9128122B2 | Stiffener plate for a probecard and method | Physics | 1 | Active |
| US6217367A | Kinematic coupling | General | 0 | Revoked |
| US7501844B2 | Liquid cooled DUT card interface for wafer sort probing | Physics | 0 | Active |
| US7541824B2 | Forced air cooling of components on a probecard | Physics | 0 | Active |
| US8354853B2 | Test electronics to device under test interfaces, and methods and apparatus using same | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.