Thin printed circuit board for manufacturing chip scale package
US7502231B2 · kind B2 · utility
3Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2007 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Dec 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is comprised of a circuit pattern, to which a semiconductor chip is adhered, and a substrate surrounding the circuit pattern. The unit printed boards are arranged in a row and includes a support molding, which is spaced a predetermined interval apart from the circuit pattern of each unit printed circuit board on the substrate of each unit printed circuit board and formed in a ring shape along the edge of the thin printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.