Patent · US Expired

Method for increasing wiring channels/density under dense via fields

US7503111B2 · kind B2 · utility

3Cited by

11References

7Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Anand Haridass · Bengaluru, IN
Dierk Kaller · Schenefeld, DE
Erich Klink · Schenefeld, DE
Gisbert Thomke · Schenefeld, DE

Key dates

Filing date	Mar 31, 2005
Grant date	Mar 17, 2009
Priority date	—
Expiry date	May 16, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49156
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for increasing the wiring channels/density under dense via fields of a circuit board are provided. With the method, the power/ground lines for the circuit board are designed to be provided in an orthogonal or diagonal pattern. The land grid array (LGA)/ball grid array (BGA) makes contact only on the surface pads of the printed circuit board with no plated through holes/vias underneath these surface pads. This opens up wiring channels, which previously used to be occupied by plated through holes and anti-pads, that can now be used for maximizing signal line wiring routing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.