Patent · US Active

Electronic device with selective nickel palladium gold plated leadframe and method of making the same

US7504712B2 · kind B2 · utility

2Cited by

4References

12Claims

0Family size

Assignee

QPL Limited · US

Inventors

Joseph Martin · Meyzieu, FR
King Yin Fred Fu · Bostanabad, IR
Hoi Ping Patrick Phen · Bostanabad, IR

Key dates

Filing date	Apr 7, 2006
Grant date	Mar 17, 2009
Priority date	—
Expiry date	Jan 24, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device comprises a leadframe attached to a die and embedded in a mold packaging with enhanced adhesion property. The leadframe comprises a bonding surface, a soldering surface, a mold adhesion surface, and a die attachment surface wherein the soldering surface and bonding surface are selectively plated with nickel/palladium/gold. The mold adhesion surface and the die attachment surface are roughened for better attachment to a mold and a die respectively.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.