Plastic semiconductor packages having improved metal land-locking features
US7504713B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2007 |
| Grant date | Mar 17, 2009 |
| Priority date | — |
| Expiry date | Mar 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a plastic package with a linear array of metal lands (202, 212) with parallel perimeter portions (203a, 213a). Pairs of adjacent lands have their facing parallel perimeter portions oriented in parallel, defining a centerline. The land perimeters have flanges remote from the surface, each flange shaped by an outline. For adjacent lands, the flanges (207b, 218, 219) of the parallel perimeter portions have asymmetrical outlines relative to the centerline and are in concord so that alternately the flange of one land diminishes its outline where the flange of the adjacent land protrudes its outline. This coordinated variation shapes the space between the adjacent flanges in a meander-like mode. Adhesive plastic material is anchored in the space to hinder a land shift along the parallel perimeter portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.