Patent · US Active

Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips

US7504721B2 · kind B2 · utility

24Cited by

4References

4Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Zhi Chen · Singapore, SG
Brian P. Gaucher · Brookfield, US
Duixian Liu · Yorktown Heights, US
Ullrich R. Pfeiffer · Wolfsburg, DE
Thomas Zwick · Leutkirch im Allgäu, DE

Key dates

Filing date	Jan 19, 2006
Grant date	Mar 17, 2009
Priority date	—
Expiry date	Jan 29, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that are integrally constructed as part of a package molding (encapsulation) process, for example, to form compact integrated radio/wireless communications systems for millimeter wave applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.