Printed circuit board having chip package mounted thereon and method of fabricating same
US7506437B2 · kind B2 · utility
1Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2005 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | May 10, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.