Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device
US7506795B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 13, 2004 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Sep 28, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and methods are provided for thermally coupling a heat dissipation device to a microelectronic device. A reflowable thermal interface material is applied between the back side of a microelectronic die and a heat dissipation device. Heat and pressure is conducted through the heat dissipation device to the interface material and producing thereby liquefaction followed by solidification of the interface material, the solidification occurring progressively from the center to the peripheral edge. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device whereby providing the desired thermal profile to effect solidification of the interface material from the center outward.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.