Electronic component device
US7508057B2 · kind B2 · utility
24Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2007 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Sep 20, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An electronic component device of the present invention includes: a silicon package unit having a structure in which a through electrode provided to a silicon substrate while an electrode post connected to the through electrode is provided upright on an upper side of the silicon substrate; an electronic component mounted on the electrode post and having a connection terminal connected to the top end of the electrode post; and a cap package unit joined onto a periphery of the silicon package unit, and constructing a housing portion in which the electronic component is housed to be hermetically sealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.