Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
US7508083B2 · kind B2 · utility
2Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2004 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Dec 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to an electronic component, which comprises a semiconductor chip. The semiconductor chip is embedded in a plastic housing in such a way that is rear side and its lateral sides are embedded in a plastic molding compound. The lateral sides and/or the rear side of the semiconductor chip have an anchoring region, by means of which the semiconductor chip is in positive engagement with the surrounding plastic molding compound. The invention also relates to a method for producing the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.