Substrate inspection method and apparatus
US7512260B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2005 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Mar 4, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30141
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Preparation steps are taken before a substrate with components is inspected and a whole image of a standard substrate is prepared preliminarily and inspection areas are determined for target portions to be inspected on this whole image. At the time of the inspection, a camera is positioned corresponding to a target portion to obtain a target image and an area corresponding to the target image is extracted from the whole image and displacement values of this area are calculated relative to the target image. The setting position of the inspection area is corrected by the calculated displacement values and an inspection area is set on the target image based on the corrected coordinates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.