IC-compatible MEMS structure
US7514760B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2007 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Mar 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/02496
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An IC-compatible MEMS structure and a method to form such a structure are described. In an embodiment, an integrated circuit having a MEMS device is formed. The structure comprises a plurality of semiconductor devices formed on a substrate. A plurality of interconnects is above and coupled with the plurality of semiconductor devices, incorporating the plurality of semiconductor devices into the integrated circuit. A MEMS resonator is formed above, and coupled with, the plurality of interconnects. In one embodiment, the MEMS resonator is comprised of a member and a pair of electrodes. The pair of electrodes is electrically coupled with the plurality of interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.