Emmanuel P. Quevy
53Patents
15h-index
19Co-inventors
77Inventor score
Filing activity: May 3, 2005 → Jun 25, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8349635B1 | Encapsulated MEMS device and method to form the same | Physics | 214 | Active |
| US7923790B1 | Planar microshells for vacuum encapsulated devices and damascene method of manufacture | Performing Operations; Transporting | 92 | Active |
| US7211926B2 | Temperature compensated oscillator including MEMS resonator for frequency control | Electricity | 92 | Expired |
| US7639104B1 | Method for temperature compensation in MEMS resonators with isolated regions of distinct material | Emerging Cross-Sectional Technologies | 67 | Active |
| US7514760B1 | IC-compatible MEMS structure | Electricity | 64 | Active |
| US7659150B1 | Microshells for multi-level vacuum cavities | Electricity | 57 | Active |
| US7256107B2 | Damascene process for use in fabricating semiconductor structures having micro/nano gaps | Emerging Cross-Sectional Technologies | 36 | Expired |
| US7595209B1 | Low stress thin film microshells | Electricity | 32 | Active |
| US8288835B2 | Microshells with integrated getter layer | Performing Operations; Transporting | 25 | Active |
| US7736929B1 | Thin film microshells incorporating a getter layer | Performing Operations; Transporting | 23 | Active |
| US7982550B1 | Highly accurate temperature stable clock based on differential frequency discrimination of oscillators | Electricity | 22 | Active |
| US7591201B1 | MEMS structure having a compensated resonating member | Emerging Cross-Sectional Technologies | 21 | Active |
| US7514853B1 | MEMS structure having a stress inverter temperature-compensated resonating member | Electricity | 20 | Active |
| US8313970B2 | Planar microshells for vacuum encapsulated devices and damascene method of manufacture | Performing Operations; Transporting | 20 | Active |
| US7999635B1 | Out-of plane MEMS resonator with static out-of-plane deflection | Electricity | 16 | Active |
| US7876167B1 | Hybrid system having a non-MEMS device and a MEMS device | Electricity | 15 | Active |
| US7956517B1 | MEMS structure having a stress inverter temperature-compensated resonator member | Electricity | 12 | Active |
| US8436690B2 | Hybrid system having a non-MEMS device and a MEMS device | Electricity | 11 | Active |
| US8878528B2 | MEMS-based magnetic sensor with a Lorentz force actuator used as force feedback | Physics | 10 | Active |
| US8273594B2 | Planar microshells for vacuum encapsulated devices and damascene method of manufacture | Performing Operations; Transporting | 9 | Active |
| US8461935B2 | Hybrid system having a non-MEMS device and a MEMS device | Electricity | 9 | Active |
| US7858422B1 | MEMS coupler and method to form the same | Performing Operations; Transporting | 8 | Active |
| US8258893B2 | Out-of-plane MEMS resonator with static out-of-plane deflection | Electricity | 7 | Active |
| US9000833B2 | Compensation of changes in MEMS capacitive transduction | Electricity | 6 | Active |
| US8852984B1 | Technique for forming a MEMS device | Performing Operations; Transporting | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.