Electronic device and method of manufacturing thereof
US7514801B2 · kind B2 · utility
1Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2004 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Aug 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with a connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. The element is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.