Fluid-ejection devices and a deposition method for layers thereof
US7517060B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2006 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Dec 28, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/03
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A cavitation structure for a print head has a first dielectric layer overlying at least a first portion of a substrate. A second dielectric layer has a first portion overlying at least a second portion of the substrate and a second portion, different from the first portion of the second dielectric layer, overlying at least a portion of the first dielectric layer. A cavitation layer has a first portion in contact with the first dielectric layer and a second portion in lateral contact with the second portion of the second dielectric layer. A third dielectric layer is disposed on only the first portion of the second dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.