Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit
US7517228B2 · kind B2 · utility
9Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2005 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Jul 11, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit may be coupled to a printed circuit board through a split socket. The integrated circuit may be packaged with a package substrate electrically coupled to a socket which, in turn, is electrically coupled to a printed circuit board. Between the printed circuit board and the package substrate, on the same side as the package substrate as the socket, may be positioned a flexible substrate. The flexible substrate may include a flexible sheet-like member made of a polymer, in one embodiment, and a plurality of microscale springs which electrically couple said flexible substrate to the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.