Patent · US Active

Thin semiconductor device package

US7517732B2 · kind B2 · utility

0Cited by

1References

9Claims

0Family size

Assignee

Intel Corporation · US

Inventors

James Jackson · Salmon Arm, CA
Damion Searls · Hillsboro, US
Yoshihiro Tomita · Tsukuba, JP

Key dates

Filing date	Apr 12, 2006
Grant date	Apr 14, 2009
Priority date	—
Expiry date	Jan 19, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A thin semiconductor device package, comprising a thin substrate, at least one thin die coupled with the substrate and having a perimeter dimension less than that of the substrate, a mold material provided at a surface of the substrate adjacent to the perimeter of the die so that a surface of the mold material is coplanar with a surface of the die, and at least one electrically conductive pathway having at least one first terminal end configured to provide electrical continuity with the conductive element and at least one second terminal end formed at a surface of the mold material, the pathway extending from the first terminal end to the second terminal end.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.