Metal cage structure and method for EMI shielding
US7518067B2 · kind B2 · utility
9Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2006 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Feb 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one exemplary embodiment, a structure comprises an electronic device situated over a substrate of a semiconductor die. The structure further includes a metal cage comprising a number of contacts situated over the substrate and surrounding the electronic device. The contacts form a lateral EMI shield portion of the metal cage. The structure also includes a number of vias connecting a number of metal interconnect segments to the contacts. The metal interconnect segments form a top EMI shield portion of the metal cage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.