Patent · US Active

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

US7518221B2 · kind B2 · utility

35Cited by

7References

1Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Brian P. Gaucher · Brookfield, US
Duixian Liu · Yorktown Heights, US
Ullrich R. Pfeiffer · Wolfsburg, DE
Thomas Zwick · Leutkirch im Allgäu, DE

Key dates

Filing date	Jan 26, 2006
Grant date	Apr 14, 2009
Priority date	—
Expiry date	May 13, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49018
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.