Process of manufacturing high frequency device packages
US7520054B2 · kind B2 · utility
2Cited by
51References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2002 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Feb 9, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53874
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a conductive material to form a center conductor for a coaxial via structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.