Apparatus and method for drying semiconductor substrates
US7520068B2 · kind B2 · utility
1Cited by
5References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2004 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | May 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67034
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A drying apparatus and method of drying a wafer including supplying a drying material for drying a wafer and controlling a flow of the drying material to uniformly or substantially dry the wafer. The flow of the drying material may be controlled by a vent unit including at least one part for controlling the flow of the drying material to uniformly or substantially uniformly dry the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.