Method and apparatus for separating disc-shaped substrates
US7520954B2 · kind B2 · utility
1Cited by
3References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 21, 2005 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Jan 4, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1944
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for separating bonded substrates and a respective apparatus used for that method is disclosed. The method comprises positioning the bonded substrates (1) in an evacuable chamber (2) by respective means, detaching a space (10) from that evacuable chamber by means of a sealing arrangement (4) so that said space comprises a partial area of the substrates with at least one gap (5) between the bonded substrates (1), lowering the pressure in the vacuum chamber (2) while maintaining the pressure in the space (10), thereby causing the bonded substrates to separate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.