Topcoat material and use thereof in immersion lithography processes
US7521172B2 · kind B2 · utility
4Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2006 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Jun 9, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2041
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a topcoat composition comprising a polymer having a dissolution rate of at least 1500 Å/second in an aqueous alkaline developer, and at least one solvent. The topcoat composition can be used to coat a photoresist layer on a material layer on a substrate, for example, a semiconductor chip. Also disclosed is a method of forming a pattern in the material layer of the coated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.