Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
US7521728B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 20, 2006 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Apr 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
Abstract
A packaged LED includes a substrate, an LED chip on the upper surface of the substrate, a first encapsulant material, including a reflective material, on the substrate and spaced apart from the LED chip, and a second encapsulant material on the LED chip. A method of forming a packaged LED includes forming a first meniscus control feature on a substrate and defining a first region of the substrate, forming a second meniscus control feature surrounding the first region and defining a second region of the substrate between the first meniscus control feature and the second meniscus control feature, mounting an LED chip within the first region, dispensing a first encapsulant material including a reflective material within the second region, curing the first encapsulant material, dispensing a second encapsulant material on the substrate within the first region, and curing the second encapsulant material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.